1. Opaque type, mini-flat package.
2. Subminiature type
(The volume is smaller than that of our conventional DIP type by
as far as 30%).
3. Current transfer ratio
(CTR:MIN.50% at IF=5mA, Vce=5V)
4. Isolation voltage between input and output (Viso:3750Vrms).
1. Hybrid substrates that reguire high density mounting.
2. Programmable controllers.
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